Magnetron sputtering is a plasma-based thin-film deposition method in which energetic ions eject atoms from a target material, allowing controlled deposition of metallic and alloy films. Process parameters such as power, pressure, and substrate bias enable tuning of film stress, density, and microstructure.
Image Source: (Captured by me, Balk Lab, University of Kentucky)
Using Sputtering in My Research
I used magnetron sputtering to deposit multicomponent VMoNbTa–Mg precursor thin films under high-vacuum conditions (base pressure ~10⁻⁸ Torr), enabling precise control of composition, thickness, and residual stress. Films were deposited onto RF-cleaned Si substrates using high-purity metal targets, with a thin Ta interlayer introduced to promote adhesion. Process pressure was carefully optimized to minimize intrinsic film stress through systematic curvature screening on compliant substrates. A combinatorial composition-gradient approach was first employed to rapidly identify precursor compositions capable of forming stable nanoporous structures. Targeted single-composition films were then deposited on rotating substrates for uniformity. Nanoporous architectures were produced via in-vacuum thermal dealloying, selectively removing Mg while preserving the refractory alloy framework. Thin-film processing enabled controlled formation of thermally stable nanoporous VMoNbTa, which was subsequently characterized using FIB-SEM, XPS depth profiling, and XRD.
I applied magnetron sputtering–based combinatorial thin-film deposition to rapidly screen equiatomic and non-equiatomic MnFeCoNiCu alloy compositions. Composition-gradient films were deposited onto stationary Si substrates by independently controlling target powers to achieve a broad compositional range across a single wafer. Film composition and thickness were mapped using EDS and FIB-SEM cross-sectioning, while phase structure was evaluated by XRD. Nanoindentation and electrochemical corrosion testing were used to correlate composition with mechanical performance and corrosion resistance. Following identification of a promising non-equiatomic composition, uniform single-composition films were deposited on rotating substrates under stress-optimized conditions. Residual stresses were quantified using wafer curvature measurements, and the thermal stability of the optimized composition was assessed through vacuum annealing and post-anneal XRD. This thin-film screening approach enabled efficient identification and validation of a high-performance MnFeCoNiCu alloy composition.
Magnetic Property of AlCrFeCoNi Thin Films were measured based on their stress condition, thickness
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